Premium Boron Nitride Ceramic Parts & Components
Boron Nitride (BN) ceramic represents one of the most versatile and high-performance engineering materials available today. Our comprehensive collection of boron nitride ceramic parts combines exceptional thermal conductivity, electrical insulation, and chemical inertness to deliver superior performance in the most demanding applications.
From high-temperature furnace components to precision electronic substrates, our BN ceramic products provide unmatched reliability across aerospace, semiconductor, metallurgy, and research applications.
Why Choose Boron Nitride Ceramic?
Exceptional Thermal Properties
- High Thermal Conductivity: Up to 60 W/m·K (parallel to pressing direction)
- Low Thermal Expansion: Excellent dimensional stability across temperature ranges
- Thermal Shock Resistance: Superior performance in rapid heating/cooling cycles
- Operating Temperature: Continuous use up to 900°C in air, 2000°C in inert atmosphere
Superior Electrical Properties
- Excellent Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm
- Low Dielectric Constant: ~4.0 at room temperature
- High Breakdown Voltage: Exceptional electrical safety
- Stable Performance: Consistent properties across temperature ranges
Outstanding Mechanical Properties
- Self-Lubricating: Natural lubricity reduces wear and friction
- Non-Wetting: Excellent release properties for molten metals
- Machinable: Can be machined to tight tolerances
- Low Density: Lightweight compared to other technical ceramics
Chemical Inertness
- Corrosion Resistance: Inert to most chemicals and molten metals
- Non-Toxic: Safe for food and pharmaceutical applications
- Oxidation Resistance: Stable in oxidizing atmospheres up to 900°C
- Non-Contaminating: Ideal for ultra-pure applications
Product Categories
BN Rods & Bars
High-precision boron nitride rods for machining custom components. Available in various diameters and lengths with consistent material properties throughout. Perfect for creating specialized parts for high-temperature applications.
- Standard diameters: 6mm to 50mm
- Length options: 50mm to 300mm
- Custom machining services available
- Tolerance: ±0.1mm standard
BN Plates & Substrates
Flat boron nitride plates ideal for electronic substrates, heat spreaders, and furnace components. Excellent surface finish and dimensional accuracy for critical applications.
- Thickness range: 0.5mm to 25mm
- Standard sizes up to 200mm x 200mm
- Custom cutting and shaping available
- Surface roughness: Ra 0.8μm typical
BN Crucibles
High-purity boron nitride crucibles for melting and casting precious metals, semiconductors, and specialty alloys. Excellent non-wetting properties prevent contamination.
- Volume range: 5ml to 500ml
- Custom shapes and sizes available
- Ultra-high purity grades for semiconductor applications
- Excellent thermal shock resistance
Custom BN Components
Precision-machined boron nitride parts manufactured to your exact specifications. Our engineering team works with you to optimize designs for BN ceramic properties.
- Complex geometries and tight tolerances
- Prototype to production volumes
- Engineering support and material optimization
- Quality certification and traceability
Technical Specifications
Property | Value | Test Method |
---|---|---|
Density | 2.1 g/cm³ | Archimedes method |
Flexural Strength | 50-80 MPa | ASTM C1161 |
Compressive Strength | 170 MPa | ASTM C773 |
Thermal Conductivity (⊥) | 30 W/m·K | Laser flash method |
Thermal Conductivity (∥) | 60 W/m·K | Laser flash method |
CTE (25-500°C) | 4.5 × 10⁻⁶/°C | ASTM E228 |
Dielectric Constant (1MHz) | 4.0 | ASTM D150 |
Volume Resistivity | >10¹⁴ Ω·cm | ASTM D257 |
Applications & Industries
Electronics & Semiconductors
- Heat Spreaders: Thermal management in high-power electronic devices
- Electronic Substrates: Insulating substrates for microwave circuits
- Semiconductor Equipment: Process chamber components and fixtures
- LED Heat Sinks: Efficient heat dissipation for LED arrays
High-Temperature Applications
- Furnace Components: Heating elements, supports, and thermal barriers
- Metal Processing: Crucibles and molds for precious metal casting
- Glass Industry: Molding tools and forming equipment
- Aerospace: Thermal protection and insulation components
Research & Laboratory
- Analytical Equipment: Sample holders and analysis components
- Materials Research: Inert containers and processing tools
- Vacuum Applications: High-temperature, low-outgassing components
- Nuclear Applications: Neutron shielding and reactor components
Industrial Manufacturing
- Metal Machining: Cutting tool components and wear parts
- Plasma Processing: Plasma-resistant components and shields
- Chemical Processing: Corrosion-resistant equipment parts
- Powder Metallurgy: Sintering aids and processing tools
Frequently Asked Questions about Boron Nitride Ceramic
Q: What makes boron nitride ceramic unique compared to other technical ceramics?
A: Boron nitride ceramic offers a unique combination of properties: high thermal conductivity (like metals), excellent electrical insulation (like ceramics), natural lubricity, and machinability. This makes it ideal for applications requiring thermal management with electrical isolation, such as electronic substrates and heat spreaders.
Q: Can boron nitride ceramic be machined to custom shapes?
A: Yes, boron nitride ceramic is highly machinable using conventional tools. It can be turned, milled, drilled, and ground to achieve complex geometries and tight tolerances. This machinability makes it cost-effective for custom components and prototypes.
Q: What is the maximum operating temperature for BN ceramic?
A: Boron nitride ceramic can operate continuously at 900°C in air and up to 2000°C in inert atmospheres. The exact temperature limit depends on the specific application, atmosphere, and mechanical stresses involved.
Q: Is boron nitride ceramic suitable for vacuum applications?
A: Absolutely. BN ceramic has very low outgassing properties and excellent vacuum compatibility. It's commonly used in high-vacuum and ultra-high-vacuum applications, including semiconductor processing equipment and research instruments.
Q: How does BN ceramic compare to aluminum nitride for thermal management?
A: While aluminum nitride has higher thermal conductivity (~170 W/m·K), boron nitride offers better machinability, lower cost, and superior chemical inertness. BN is also non-toxic and can be used in direct food contact applications, making it more versatile for many applications.
Q: Can BN ceramic withstand thermal shock?
A: Yes, boron nitride ceramic has excellent thermal shock resistance due to its low thermal expansion and good thermal conductivity. This makes it suitable for applications involving rapid temperature changes, such as furnace components and metal processing equipment.
Q: What purity levels are available for boron nitride ceramic?
A: We offer boron nitride ceramic in various purity levels, from standard industrial grade (>95% BN) to ultra-high purity grades (>99.5% BN) for semiconductor and analytical applications. The purity level affects both performance and cost.
Q: How do I choose the right BN ceramic grade for my application?
A: Consider these factors: operating temperature, mechanical stresses, purity requirements, and cost constraints. Our technical team can help you select the optimal grade and design for your specific application requirements.
Boron Nitride Ceramic Selection Guide
Grade Selection by Application
Standard Grade BN (95-98% purity)
- Best for: General industrial applications, tooling, furnace components
- Thermal Conductivity: 25-40 W/m·K
- Cost: Most economical option
- Applications: Metal casting, glass forming, general high-temperature use
High Purity Grade BN (98-99% purity)
- Best for: Electronic applications, precision components
- Thermal Conductivity: 40-55 W/m·K
- Cost: Moderate premium
- Applications: Heat spreaders, electronic substrates, analytical equipment
Ultra-High Purity BN (>99.5% purity)
- Best for: Semiconductor, pharmaceutical, food contact
- Thermal Conductivity: 55-60 W/m·K
- Cost: Premium pricing
- Applications: Semiconductor processing, analytical crucibles, medical devices
Application-Specific Recommendations
Application | Recommended Grade | Key Properties | Typical Components |
---|---|---|---|
Electronics/Thermal Management | High Purity | High thermal conductivity, electrical insulation | Heat spreaders, substrates, LED heat sinks |
High-Temperature Furnaces | Standard Grade | Thermal shock resistance, chemical inertness | Heating elements, supports, thermal barriers |
Metal Processing | Standard/High Purity | Non-wetting, high temperature resistance | Crucibles, molds, casting tools |
Semiconductor Equipment | Ultra-High Purity | Low contamination, high purity | Process chambers, wafer handling, fixtures |
Analytical/Laboratory | High/Ultra-High Purity | Chemical inertness, high purity | Sample holders, crucibles, analysis tools |
Design Considerations for BN Ceramic Parts
Mechanical Design:
- Wall Thickness: Minimum 2mm for structural integrity
- Stress Concentration: Avoid sharp corners and notches
- Thermal Expansion: Account for anisotropic expansion properties
- Support: Provide adequate support for large, thin sections
Machining Guidelines:
- Tooling: Carbide or diamond tools recommended
- Speeds: Moderate cutting speeds with adequate cooling
- Tolerances: ±0.05mm achievable with careful machining
- Surface Finish: Ra 0.4μm achievable with proper techniques
Joining Methods:
- Mechanical Fastening: Preferred method for removable assemblies
- High-Temperature Adhesives: For permanent bonds up to 1000°C
- Brazing: Possible with special techniques and filler materials
- Design Integration: Consider thermal expansion matching